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AGFD023R24C2I2V
Part number: AGFD023R24C2I2V
Description: IC
Manufacturer Intel
Encapsulation Tray
Quantity 1
RoHS
TYPEDESCRIPTION
Mfr"Intel"
Package / Case 2340-BFBGA Exposed Pad
Speed 1.4GHz
RAM Size 256KB
Number of I/O 480
Operating Temperature -40°C ~ 100°C (TJ)
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes FPGA - 2.3M Logic Elements
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals DMA, WDT
Supplier Device Package 2340-BGA (45x42)
Architecture MPU, FPGA
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