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W66BQ6NBQAHJ
Part number: W66BQ6NBQAHJ
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Manufacturer Winbond Electronics Corporation
Encapsulation Tray
Quantity 1
RoHS
TYPEDESCRIPTION
Mfr"Winbond Electronics Corporation"
Package / Case 200-TFBGA
Mounting Type Surface Mount
Memory Size 2Gbit
Memory Type Volatile
Operating Temperature -40°C ~ 105°C (TC)
Voltage - Supply 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology SDRAM - Mobile LPDDR4X
Clock Frequency 2.133 GHz
Memory Format DRAM
Supplier Device Package 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page 18ns
Memory Interface LVSTL_06
Access Time 3.6 ns
Memory Organization 128M x 16
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