| Part number: | BLF6G22LS-100%2C118 |
| Description: | NXP Semiconductors |
| Manufacturer | NXP Semiconductors |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Source Content uid: | BLF6G22LS-100,118 |
| Manufacturer Part Number: | BLF6G22LS-100,118 |
| Brand Name: | NXP Semiconductor |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Transferred |
| Part Package Code: | SOT |
| Package Description: | ROHS COMPLIANT, CERAMIC PACKAGE-2 |
| Pin Count: | 2 |
| Manufacturer Package Code: | SOT502B |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8541.29.00.75 |
| Manufacturer: | NXP Semiconductors |
| Risk Rank: | 5.27 |
| Case Connection: | SOURCE |
| Configuration: | SINGLE |
| DS Breakdown Voltage-Min: | 65 V |
| Drain Current-Max (Abs) (ID): | 29 A |
| Drain Current-Max (ID): | 29 A |
| FET Technology: | METAL-OXIDE SEMICONDUCTOR |
| Highest Frequency Band: | S BAND |
| JESD-30 Code: | R-CDFP-F2 |
| Number of Elements: | 1 |
| Number of Terminals: | 2 |
| Operating Mode: | ENHANCEMENT MODE |
| Operating Temperature-Max: | 225 °C |
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Package Shape: | RECTANGULAR |
| Package Style: | FLATPACK |
| Peak Reflow Temperature (Cel): | 245 |
| Polarity/Channel Type: | N-CHANNEL |
| Qualification Status: | Not Qualified |
| Subcategory: | FET General Purpose Power |
| Surface Mount: | YES |
| Terminal Form: | FLAT |
| Terminal Position: | DUAL |
| Time@Peak Reflow Temperature-Max (s): | 40 |
| Transistor Application: | AMPLIFIER |
| Transistor Element Material: | SILICON |
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