| Part number: | TP5335K1-G |
| Description: | Microchip Technology Inc |
| Manufacturer | Microchip Technology Inc |
| Encapsulation | - |
| Quantity | 0 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Source Content uid: | TP5335K1-G |
| Manufacturer Part Number: | TP5335K1-G |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Active |
| Package Description: | 2.90 X 1.30 MM, 1.12 MM HEIGHT, GREEN PACKAGE-3 |
| Reach Compliance Code: | compliant |
| ECCN Code: | EAR99 |
| HTS Code: | 8541.29.00.95 |
| Manufacturer: | Microchip Technology Inc |
| Risk Rank: | 1.25 |
| Additional Feature: | LOW THRESHOLD |
| Configuration: | SINGLE WITH BUILT-IN DIODE |
| DS Breakdown Voltage-Min: | 350 V |
| Drain Current-Max (ID): | 0.085 A |
| Drain-source On Resistance-Max: | 30 Ω |
| FET Technology: | METAL-OXIDE SEMICONDUCTOR |
| Feedback Cap-Max (Crss): | 22 pF |
| JEDEC-95 Code: | TO-236AB |
| JESD-30 Code: | R-PDSO-G3 |
| JESD-609 Code: | e3 |
| Moisture Sensitivity Level: | 1 |
| Number of Elements: | 1 |
| Number of Terminals: | 3 |
| Operating Mode: | ENHANCEMENT MODE |
| Operating Temperature-Max: | 150 °C |
| Operating Temperature-Min: | -55 °C |
| Package Body Material: | PLASTIC/EPOXY |
| Package Shape: | RECTANGULAR |
| Package Style: | SMALL OUTLINE |
| Peak Reflow Temperature (Cel): | 260 |
| Polarity/Channel Type: | P-CHANNEL |
| Power Dissipation-Max (Abs): | 0.36 W |
| Qualification Status: | Not Qualified |
| Subcategory: | Other Transistors |
| Surface Mount: | YES |
| Terminal Finish: | Matte Tin (Sn) - annealed |
| Terminal Form: | GULL WING |
| Terminal Position: | DUAL |
| Time@Peak Reflow Temperature-Max (s): | 40 |
| Transistor Application: | SWITCHING |
| Transistor Element Material: | SILICON |
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