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BB153%2C135
Part number: BB153%2C135
Description: BB153 Single Surface Mount 2.754pF @ 28V 1MHz -55°C~125°C TJ Capacitance Ratio-15 32V 2 Terminations SILICON DUAL SC-76, SOD-323
Manufacturer NXP USA Inc.
Encapsulation -
Quantity 10449
RoHS YES
TYPEDESCRIPTION
Mounting Type Surface Mount
Package / Case SC-76, SOD-323
Surface Mount YES
Diode Element Material SILICON
Operating Temperature -55°C~125°C TJ
Packaging Tape & Reel (TR)
Published 2013
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin (Sn)
Additional Feature 2% MATCHED SETS OF 10 DIODES ARE AVAILABLE
HTS Code 8541.10.00.70
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number BB153
Pin Count 2
JESD-30 Code R-PDSO-G2
Qualification Status Not Qualified
Number of Elements 1
Diode Type Single
Capacitance @ Vr, F 2.754pF @ 28V 1MHz
Voltage - Peak Reverse (Max) 32V
Breakdown Voltage-Min 32V
Frequency Band VERY HIGH FREQUENCY TO ULTRA HIGH FREQUENCY
Diode Capacitance-Nom 38.5pF
Capacitance Ratio 15
Capacitance Ratio Condition C1/C28
Diode Cap Tolerance 10%
RoHS Status ROHS3 Compliant
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