TYPE | DESCRIPTION |
Factory Lead Time | 14 Weeks |
Package / Case | 624-LFBGA |
Surface Mount | YES |
Operating Temperature | -40°C~125°C TJ |
Packaging | Tray |
Series | i.MX6S |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 624 |
HTS Code | 8542.31.00.01 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 260 |
Terminal Pitch | 0.8mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
JESD-30 Code | S-PBGA-B624 |
Supply Voltage-Max (Vsup) | 1.5V |
Supply Voltage-Min (Vsup) | 1.275V |
Speed | 800MHz |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Core Processor | ARM® Cortex®-A9 |
Address Bus Width | 16 |
Boundary Scan | YES |
Low Power Mode | YES |
External Data Bus Width | 32 |
Format | FLOATING POINT |
Integrated Cache | YES |
Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
Ethernet | 10/100/1000Mbps (1) |
Number of Cores/Bus Width | 1 Core 32-Bit |
Graphics Acceleration | Yes |
RAM Controllers | LPDDR2, LVDDR3, DDR3 |
USB | USB 2.0 + PHY (4) |
Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Co-Processors/DSP | Multimedia; NEON™ SIMD |
Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
Display & Interface Controllers | Keypad, LCD |
Length | 21mm |
Height Seated (Max) | 1.6mm |
RoHS Status | ROHS3 Compliant |