| Part number: | SE98PW%2C118 |
| Description: | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management |
| Manufacturer | NXP USA Inc. |
| Encapsulation | - |
| Quantity | 18212 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Mounting Type | Surface Mount |
| Package / Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C |
| Packaging | Tape & Reel (TR) |
| Published | 2009 |
| JESD-609 Code | e4 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Voltage - Supply | 1.7V~3.6V |
| Base Part Number | SE98 |
| Function | Temp Monitoring System (Sensor) |
| Body Length or Diameter | 4.4mm |
| Body Breadth | 3 mm |
| Output Type | I2C/SMBus |
| Power Supplies | 3.3V |
| Termination Type | SOLDER |
| Number of Bits | 16 |
| Accuracy | ±4°C(Max) |
| Topology | ADC (Sigma Delta), Register Bank |
| Sensor Type | Internal |
| Sensors/Transducers Type | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL |
| Housing | PLASTIC |
| Output Interface Type | 2-WIRE INTERFACE |
| Output Alarm | Yes |
| Sensing Temperature | -40°C~125°C |
| Body Height | 1.1mm |
| RoHS Status | ROHS3 Compliant |
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