| Part number: | MPXV8500DK016T1 |
| Description: | TPMS P+ZCELL+MCU 5 HOLE |
| Manufacturer | NXP Semiconductors |
| Encapsulation | - |
| Quantity | 13352 |
| RoHS | YES |
| TYPE | DESCRIPTION |
| Manufacturer Part Number: | MPXV8500DK016T1 |
| Rohs Code: | Yes |
| Part Life Cycle Code: | Obsolete |
| Ihs Manufacturer: | NXP SEMICONDUCTORS |
| Package Description: | QFN-32 |
| Reach Compliance Code: | compliant |
| Manufacturer: | NXP Semiconductors |
| Risk Rank: | 5.83 |
| JESD-30 Code: | S-XQCC-N32 |
| Length: | 9 mm |
| Number of Terminals: | 32 |
| Operating Temperature-Max: | 125 °C |
| Operating Temperature-Min: | -40 °C |
| Package Body Material: | UNSPECIFIED |
| Package Code: | HQCCN |
| Package Shape: | SQUARE |
| Package Style: | CHIP CARRIER, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel): | NOT SPECIFIED |
| Seated Height-Max: | 2.3 mm |
| Supply Voltage-Max: | 3.6 V |
| Supply Voltage-Min: | 1.8 V |
| Supply Voltage-Nom: | 3 V |
| Surface Mount: | YES |
| Technology: | CMOS |
| Temperature Grade: | AUTOMOTIVE |
| Terminal Form: | NO LEAD |
| Terminal Pitch: | 0.65 mm |
| Terminal Position: | QUAD |
| [email protected] Reflow Temperature-Max (s): | NOT SPECIFIED |
| Width: | 9 mm |
| uPs/uCs/Peripheral ICs Type: | MICROPROCESSOR CIRCUIT |
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