| Part number: | ZSSC3123AI6C |
| Description: | DICE (WAFER SAWN) - FRAME |
| Manufacturer | Intersil (Renesas Electronics Corporation) |
| Encapsulation | Tray |
| Quantity | 9464 |
| RoHS | 1 |
| TYPE | DESCRIPTION |
| Mfr | "Intersil (Renesas Electronics Corporation)" |
| Package / Case | Die |
| Output Type | I2C, SPI |
| Mounting Type | Surface Mount |
| Type | Capacitive Sensor |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Input Type | Capacitive |
| Supplier Device Package | Die |
| Current - Supply | 1.1 mA |
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