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Products
EP1K30FI256-2
Part number: EP1K30FI256-2
Description: IC FPGA 171 I/O 256FBGA
Manufacturer Intel
Encapsulation Tray
Quantity 90
RoHS
TYPEDESCRIPTION
Mfr"Intel"
Package / Case 256-BGA
Mounting Type Surface Mount
Number of Gates 119000
Operating Temperature -40°C ~ 85°C (TA)
Voltage - Supply 2.375V ~ 2.625V
Number of Logic Elements/Cells 1728
Supplier Device Package 256-FBGA (17x17)
Number of LABs/CLBs 216
Total RAM Bits 24576
Number of I/O 171
DigiKey Programmable Not Verified
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